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Jan 01 2003 · Polishing processes are critical to high value production processes such as IC manufacturing. The fundamental material removal mechanisms howeve are poorly understood. Technological outputs (e.g. surface finish sub-surface damage part shape) and throughput of lapping and polishing processes are affected by a large number of variables.
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Manufacturedsilicon carbide dry ice baking soda sponges aluminum oxide and glass beads. Of the above abrasive types the most commonly used are the cast shot and grit for shop
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Jan 01 2003 · Polishing processes are critical to high value production processes such as IC manufacturing. The fundamental material removal mechanisms howeve are poorly understood. Technological outputs (e.g. surface finish sub-surface damage part shape) and throughput of lapping and polishing processes are affected by a large number of variables.
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Jan 01 2003 · Polishing processes are critical to high value production processes such as IC manufacturing. The fundamental material removal mechanisms howeve are poorly understood. Technological outputs (e.g. surface finish sub-surface damage part shape) and throughput of lapping and polishing processes are affected by a large number of variables.
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Shell cross-sections were progressively polished with silicon carbide paper (grit size from P800 to P2500) and diamond paste (grading from 9 μm to 3 μm). lapidary wheels using grits of 400
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Japan) using 400# 600# and 1200#-grits silicon-carbide (SiC) abrasive papers and treated in an ultrasonic bath (5 min) con- 180-grit SiC abrasive paper mounted on a water-cooled rotating.
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